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Changes due to differences in acceleration voltage during EDX analysis.

Confirm changes due to differences in acceleration voltage! Analyze under appropriate conditions based on accumulated know-how!

When conducting EDX analysis, many people may analyze at high acceleration voltages to increase the detection sensitivity of elements. However, depending on the purpose, it is not always the case that high acceleration voltage analysis is preferable. White LEDs generate white light by combining blue LEDs with yellow phosphors (powder), and in this study, we examined how changing the acceleration voltage affects the surface analysis of these phosphors. Please take a moment to read this. [Contents] - Test sample (LED phosphor) - Surface analysis images at different acceleration voltages - Considerations from electron beam scattering regions using Monte Carlo simulations *For more details, please refer to the PDF document or feel free to contact us.

Company：アイテス
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Detection sensitivity due to differences in acceleration voltage during SEM-EDX analysis.

Appropriate acceleration conditions for accurate analysis results! The detection depth of EDX changes with differences in acceleration voltage!

This presentation introduces the detection sensitivity related to differences in acceleration voltage during SEM-EDX analysis. When analyzing the gold-plated surface of a typical printed circuit board (PCB), there are instances where the underlying nickel is detected even though it is not exposed. This is related to the scattering depth of the electron beam, and it is essential to set appropriate acceleration conditions to obtain accurate analysis results. In this study, we conducted an examination of the EDX detection depth based on differences in acceleration voltage using Monte Carlo simulations. This is just one example, but it is important to consider how electrons scatter while setting the acceleration voltage to achieve accurate analysis results. [Test Board Overview] - The sample used is a gold-plated pad from a typical printed circuit board (PCB). - The layer structure consists of nickel plating and gold plating on copper wiring. - The thickness of the gold plating, as observed in cross-section, is 212 nm. *For more details, please refer to the PDF document or feel free to contact us.*